Description
Lucas-Milhaupt, Inc. HANDY FLO® 20" x 0.125" x 0.05", 6% Silver, 88% Copper, 6% Phosphorus, 0.15% Other Element, Light Copper, Strip, Brazing Alloy
Features & Benefits
- Joins CU to CU (phosphorus serves as flux)
- Joins CU to Brass (flux is recommended)
- Melts and flows at temperatures very close to 15% Ag
- Slow Flow
- Made in USA
Specifications
- Type: Strip
- Filler Metal: 6 Percent Silver, 88 Percent Copper, 6 Percent Phosphorus, 0.15 Percent Other Element
- Melting Temperature: 1325 Deg F
- Metal Used On: Copper
- Overall Dimension 20 Inch Length x 0.125 Inch Width x 0.05 Inch Thickness
- Physical State Solid
- Flow Point 1300 Deg F
- Brazing Temperature Range 1300 to 1500 Deg F
- Color Light Copper
- Specific Gravity 8.14
- Density 0.294 Ounce
- Applicable Standard ANSI Z49.1
Replacement for
Documents
Specifications
- BrandLucas-Milhaupt
- BrandLucas-Milhaupt
- Shipping Weight25 lb